| Pavilion Track | UT-CAT-06 Low-Loss High-Layer PCB & Precision PCBA Assembly Pavilion |
|---|---|
| Procurement Mode | DPS_STANDING |
| Window Status | Standing DPS Pool · Window >4 Weeks |
| Target Macro-Region | Southeast Asia |
| Estimated Batch Band | 200–500 Units (Annual Standing Pool) |
| Structured Technical Parameters |
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| Genericized Engineering Specification & QA Baseline | Scope: High-Layer-Count Low-Loss PCBs (HLC/HDI) & Precision PCBA Sub-Assemblies. Engineering Specs: IEC 61850 substation protocol & EMC immunity; low-Dk multi-layer PCB & IPC Class 3 SMT assembly. Estimated Batch: 200–500 Units (Annual Standing Pool). Required Standards & QA: IPC-A-600 / ISO 9001 / RoHS / REACH / UL / IEC 61850 compliance documentation and factory test reports. |
| Mandatory International Certifications | |
| Invited Industrial Belts | Kunshan/Nantong (Jiangsu) · Shenzhen/Huizhou/Meizhou/Zhuhai · Huangshi (Hubei) · Ganzhou (Jiangxi) |
| Corporate Capability Submission | Submit corporate manufacturing capability & certification docs referencing the Demand ID to U-TRADE GATEWAY LIMITED ([email protected]) |